Temperature and strain rate effects in grain boundary sliding

Materials Research Society Symposium - Proceedings

Volumn 408, Issue , 1996, Pages 277-282

  Molteni, C ^a   Francis, G P ^a   Payne, M C ^a   Heine, V ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTER SIMULATION; DEFORMATION; POLYCRYSTALS; PROBABILITY DENSITY FUNCTION; QUANTUM THEORY; SEMICONDUCTING GERMANIUM; STRAIN RATE; THERMAL EFFECTS;

AB INITIO SIMULATION; BOND BREAKING; INTERATOMIC BONDING; SLIDING PROCESS;

GRAIN BOUNDARIES;

EID: 0030315713     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)