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Volumn 46, Issue 2-3, 1996, Pages 248-251

Influence of interfacial copper during the dealloying and nitridation of Cu-Ti films

Author keywords

Dealloying; Interfacial copper; Nitridation

Indexed keywords

ANNEALING; CATALYSIS; COPPER ALLOYS; INTERFACES (MATERIALS); REACTION KINETICS; SILICA; X RAY ANALYSIS;

DEALLOYING; HIGH RESOLUTION ENERGY DISPERSIVE X RAY TECHNIQUE; INTERFACIAL COPPER;

METALLIC FILMS;

EID: 0030291471 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/S0254-0584(96)01806-8 Document Type: Article

Times cited : (2)

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