A study of the corrosive effect of soldering fluxes on printed circuit boards: Six corrosions tests were evaluated as to their effectiveness in assessing the corrosive characteristics of commercial rosins used in the electronics industry

Welding Journal (Miami, Fla)

Volumn 75, Issue 11, 1996, Pages

  Galvan J C ^a   Bastidas, J M ^b   Feliu, S ^b  

^a INSTITUTO DE CIENCIA DE MATERIALES DE MADRID   (Spain)

^b DEPARTMENT OF PHYSICAL METALLURGY   (Spain)

Author keywords

Chloride Content; Conductivity; Copper Sheet Test; Corrosion Rate; Drop Test; Electrodeposition; Impedance; pH Aqueous Solution; Rosin; Soldering Flux

Indexed keywords

CORROSIVE EFFECTS; ELECTRODEPOSITION; LIQUID METALS; PH; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; SPECTROSCOPY;

AQUEOUS ROSIN EXTRACTS; CHLORIDE CONTENT; COPPER SHEET TEST; DROP TEST; ROSINS; SOLDERING FLUXES;

FLUXES;

EID: 0030290334     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (21)

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