In situ study of processes taking place on silicon surface during its bombardment by CFx/Ar ions: Etching versus polymerization

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 14, Issue 6, 1996, Pages 3156-3163

  Sikola T ^a   Armour, D G ^b   Van Den Berg, J A ^b  

^a BRNO UNIVERSITY OF TECHNOLOGY   (Czech Republic)

^b UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; CARBON TETRACHLORIDE; ETCHING; ION BOMBARDMENT; MATHEMATICAL MODELS; PLASMAS; POLYMERIZATION; SPECTROSCOPY; SPUTTERING; SUBSTRATES; SURFACES; THIN FILMS;

FLUOROCARBON POLYMERIC THIN FILM; IN SITU ANALYSIS; KAUFMAN ION SOURCE;

SEMICONDUCTING SILICON;

EID: 0030290280     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.580206     Document Type: Article

References (23)

1. T. M. Mayer, R. A. Barker, and L. J. Whitman, J. Vac. Sci. Technol. 21, 757 (1982).
2. T. M. Mayer, R. A. Baker, and L. J. Whitman, J. Vac. Sci. Technol. 18, 349 (1981).
3. T. M. Mayer and R. A. Barker, J. Electrochem. Soc. 1, 129 (1982).
4. R. D'Agostino, in Plasma Deposition, Treatment and Etching of Polymers, edited by R. D'Agostino (Academic, Orlando, 1990).
5. T. I. Cox, V. G. I. Deshmukh, and D. G. Armour, J. Vac. Sci. Technol. A 8, 1685 (1990).
6. R. S. Robinson, J. Vac. Sci. Technol. 16, 185 (1979).
7. L. C. Feldman and J. W. Mayer, Fundamentals of Surface and Thin Film Analysis (North-Holland, New York, 1986).
8. J. C. Rivière, Surface Analytical Techniques (Clarendon, Oxford, 1990).
9. D. P. Smith, J. Appl. Phys. 38, 340 (1967).
10. H. Niehus, W. Heiland, and E. Taglauer, Surf. Sci. Rep. 17, 213 (1993).
11. D. G. Armour, in Methods of Surface Analysis, edited by J. M. Walls (Cambridge University Press, Cambridge, 1989).
12. R. Smith and J. M. Walls, in Methods of Surface Analysis, edited by J. M. Walls (Cambridge University Press, Cambridge, 1989).
13. J. M. E. Harper and J. J. Cuomo, J. Vac. Sci. Technol. 21, 737 (1982).
14. A. Benninghoven and F. G. Rudennauer, SIMS, Chemical Analysis, edited by P. J. Elving (Wiley, New York, 1987), Vol. 86.
15. Ch. Steinbrüchel, J. Vac. Sci. Technol. B 2, 38 (1984).
16. G. Carter and D. G. Armour, Thin Solid Films 80, 13 (1981).
17. J. W. Coburn, H. F. Winters, and T. J. Chuang, J. Appl. Phys. 48, 3532 (1977).
18. G. S. Oehrlein et al., J. Electrochem. Soc., Solid-State Sci. Technol. 132, 1441 (1985).
19. G. S. Oehrlein and H. L. Williams, J. Appl. Phys. 62, 662 (1987).
20. W. H. Chang, I. Bello, and W. M. Lau, J. Vac. Sci. Technol. A 11, 1221 (1993).
21. D. J. Vitkavage and T. M. Mayer, J. Vac. Sci. Technol. B 4, 1283 (1986).
22. B. D. Ratner, in Plasma Deposition, Treatment and Etching of Polymers, edited by R. D'Agostino (Academic, Orlando, 1990).
23. H. F. Winters, J. W. Coburn, and T. J. Chuang, J. Vac. Sci. Technol. B 1, 469 (1983).