Improvement in parameter spreads of YBaCuO/PrBaCuO/YBaCuO trilayer junctions

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 35, Issue 11 PART A, 1996, Pages

  Sato, Hiroshi ^a   Nakamura, Norito ^a,b   Gjøen, Stein Roar ^a   Akoh, Hiroshi ^a  

^a ELECTROTECHNICAL LABORATORY   (Japan)

^b CHIBA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

1 spreads; Al Cu Al stacked foils; Backing plate; Critical current density; Normal resistance; YBaCuO trilayer junction

Indexed keywords

ALUMINUM FOIL; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); CURRENT VOLTAGE CHARACTERISTICS; DEPOSITION; ELECTRIC RESISTANCE; MULTILAYERS; PARTICLES (PARTICULATE MATTER); PRASEODYMIUM COMPOUNDS; SUBSTRATES; SUPERCONDUCTING MATERIALS; YTTRIUM COMPOUNDS;

BACKING PLATE; NORMALIZED JUNCTION RESISTANCE; RESISTIVELY SHUNTED JUNCTION (RSJ); TRILAYER JUNCTIONS;

SUPERCONDUCTING FILMS;

EID: 0030290043     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.l1411     Document Type: Article

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