Intergranular/transgranular fatigue of copper: Influence of environment on crack path and propagation rates

Materials Science and Engineering: A

Volumn 219, Issue 1-2, 1996, Pages 56-65

  Tromans, Desmond ^a   Sun, Ru Hong ^a,b  

^a UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^b Ministry of Information Industry   (China)

Author keywords

Fatigue specimens; Intergranular cracking; Transgranular cracking

Indexed keywords

ANODIC OXIDATION; CRACK INITIATION; CRACK PROPAGATION; DEFORMATION; DISSOLUTION; FATIGUE OF MATERIALS; FATIGUE TESTING; GRAIN BOUNDARIES; GRANULAR MATERIALS; LOADS (FORCES); POLYCRYSTALLINE MATERIALS; STRESSES;

CYCLIC LOADING EFFECTS; INTERGRANULAR FATIGUE; TRANSGRANULAR FATIGUE;

COPPER;

COPPER; CRACK PROPAGATION; FATIGUE;

EID: 0030287758     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(96)10422-6     Document Type: Article

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