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Volumn 31, Issue 21, 1996, Pages 5623-5630

The effect of stacking fault energy on the microstructural development during room temperature wire drawing in Cu, Al and their dilute alloys

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPOSITION; COPPER; COPPER ALLOYS; STACKING FAULTS; STRAIN; WIRE DRAWING;

EID: 0030287527     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF01160807     Document Type: Article
Times cited : (11)

References (26)
  • 1
    • 0003659421 scopus 로고
    • Reprinted by Techbooks (original publisher was Addison-Wesley Publishing Co. Herndon, VA)
    • L. E. MURR, "Interfacial Phenomenon in Metals and Alloys", Reprinted by Techbooks (original publisher was Addison-Wesley Publishing Co. Herndon, VA, 1975) pp. 145-148.
    • (1975) Interfacial Phenomenon in Metals and Alloys , pp. 145-148
    • Murr, L.E.1
  • 19
    • 0003010725 scopus 로고
    • edited by M. H. Yoo and M. Wuttig (The Minerals, Metals and Materials Society, Pittsburg, PA)
    • G. T. GRAY III, Idem, in "Twinning in Advanced Materials", edited by M. H. Yoo and M. Wuttig (The Minerals, Metals and Materials Society, Pittsburg, PA, 1994) pp. 337-349.
    • (1994) Twinning in Advanced Materials , pp. 337-349
    • Gray III, G.T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.