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Volumn 31, Issue 21, 1996, Pages 5623-5630
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The effect of stacking fault energy on the microstructural development during room temperature wire drawing in Cu, Al and their dilute alloys
a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
COMPOSITION;
COPPER;
COPPER ALLOYS;
STACKING FAULTS;
STRAIN;
WIRE DRAWING;
CELL STRUCTURE;
COPPER ALUMINUM ALLOYS;
DEFORMATION BANDS;
DEFORMATION MECHANISMS;
DEFORMATION TWINS;
SIZE REFINEMENT;
STACKING FAULT ENERGY;
CRYSTAL MICROSTRUCTURE;
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EID: 0030287527
PISSN: 00222461
EISSN: None
Source Type: Journal
DOI: 10.1007/BF01160807 Document Type: Article |
Times cited : (11)
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References (26)
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