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Volumn 288, Issue 1-2, 1996, Pages 90-94
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Electrodeposition of copper-indium alloy under diffusion-limiting current control
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Author keywords
Copper; Deposition process; Electrochemistry; Indium
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Indexed keywords
COMPOSITION EFFECTS;
DIFFUSION IN SOLIDS;
ELECTRIC CURRENT CONTROL;
ELECTRODEPOSITION;
MORPHOLOGY;
SEMICONDUCTING SELENIUM;
STOICHIOMETRY;
THIN FILMS;
COPPER INDIUM ALLOY;
DIFFUSION LIMITING CURRENTS;
METAL RATIO;
SELENIZATION;
THIN FILM SOLAR CELLS;
COPPER ALLOYS;
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EID: 0030284088
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/S0040-6090(96)08817-7 Document Type: Article |
Times cited : (16)
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References (22)
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