In-situ monitoring of dry corrosion degradation of Au ball bonds to Al bond pads in plastic packages during HTSL

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1931-1934

  Ragay, F W ^a   Pol, J A V D ^a   Naderman, J ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CORROSION; CORROSIVE EFFECTS; DEGRADATION; ELECTRIC RESISTANCE; FAILURE ANALYSIS; HIGH TEMPERATURE TESTING; OXIDATION; PLASTICS MOLDING; RELIABILITY;

DRY CORROSION; HIGH TEMPERATURE STORAGE LIFE (HTSL) TESTING;

ELECTRONICS PACKAGING;

EID: 0030283158     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00231-4     Document Type: Article

References (2)

1. Application of the in-situ method to off-chip interconnects (ball bonds), DESTIN NV Reliability Engineering
2. L. Tielemans et al., Contact resistance of Au and Cu ball bonds on aluminium metallisations, Proc. 7th Hybrid Microelectronics conference, Hamburg, 1989