Quality and reliability improvement through defect oriented failure analysis

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1835-1838

  De Pauw, P ^a   Van Haeverbeke, S ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL DEFECTS; FAILURE ANALYSIS; QUALITY ASSURANCE; RELIABILITY; SEMICONDUCTOR DEVICE TESTING; ELECTRIC CURRENT MEASUREMENT; ELECTRON MICROSCOPES; ION BEAMS; QUALITY CONTROL;

STUCK AT TESTED INTEGRATED CIRCUITS; DEFECT ORIENTED FAILURE ANALYSIS;

INTEGRATED CIRCUIT TESTING;

EID: 0030274021     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00209-0     Document Type: Article

References (4)

1. H. Manhaeve, P. Wrighton, J. Van Sas, and U. Swerts, "An Off-chip IDDq Current Measurement Unit for Telecommunication ASIC's", Proc. Int. Test Conf., Oct 1994, pp.203-212.
2. J. Van Sas, U. Swerts, M. Darquennes "Towards an Effective Test Vector Selection and Application Methodology", submitted for publication (1996).
3. P. De Pauw, "IDDQ in Alcatel", European Design and test conference, Paris, 1996.
4. Ph. Wolbert, "Relation between Yield and Reliability of Integrated Circuits: Experimental Results and Application to continuous Early failure Rate Reduction Programs", IRPS 1995.