Copper interconnection lines: Sarf characterization and lifetime test

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1747-1750

  Ciofi, C ^a   Dattilo, V ^a   Neri, B ^a  

^a UNIVERSITY OF PISA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CORRELATION METHODS; DEPOSITION; ELECTRIC RESISTANCE; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; METALLIZING; MICROSTRUCTURE; SILICON; SPECTRUM ANALYSIS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE TESTING;

COPPER INTERCONNECTION LINES; ELECTROMIGRATION NOISE; SPECTRAL ANALYSIS OF RESISTANCE FLUCTUATIONS (SARF);

SEMICONDUCTING FILMS; THIN FILMS;

EID: 0030274002     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00189-8     Document Type: Article

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