Solderless flexible thermal links

Cryogenics

Volumn 36, Issue 10, 1996, Pages 867-869

  Williams, B ^a   Jensen, S ^a   Chadek, M ^a   Batty, J C ^a  

^a UTAH STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COPPER; DEGASSING; HEAT TRANSFER; INTERFACES (MATERIALS); SOLDERING; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL VARIABLES CONTROL;

CRYOGENICALLY COOLED INSTRUMENTS; LINK FABRICATION; THERMAL IMPEDANCE; THERMAL LINKS; THERMAL MANAGEMENT;

CRYOGENIC EQUIPMENT;

EID: 0030270364     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/0011-2275(96)00050-1     Document Type: Article

References (0)