Effect of mold heat transfer on the curing reaction of epoxy molding compound during transfer molding

International Communications in Heat and Mass Transfer

Volumn 23, Issue 6, 1996, Pages 779-788

  Hu, S Y ^a   Chang, Y P ^a   Jong, W R ^a   Chen, S C ^a  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; COMPUTER SIMULATION; CURING; EFFECTS; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; PLASTICS MOLDING;

CAVITY SURFACE; DUAL RECIPROCITY BOUNDARY ELEMENT METHOD; EPOXY MOLDING COMPOUND; FINITE ELEMENT SHAPE FACTOR METHOD;

HEAT TRANSFER;

ANALYSIS-MATHEMATICAL; HEAT TRANSFER; MOULDING MACHINES; POLYMERS;

EID: 0030268108     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/0735-1933(96)00061-9     Document Type: Article

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