Natural convection to air from an array of vertical parallel plates with discrete and protruding heat sources

International Journal of Heat and Fluid Flow

Volumn 17, Issue 5, 1996, Pages 483-490

  Fujii, M ^a   Gima, S ^b   Tomimura, T ^a   Zhang, X ^a  

^a KYUSHU UNIVERSITY   (Japan)

^b UNIVERSITY OF THE RYUKYUS   (Japan)

Author keywords

Electronic equipment; Heat conduction; Heat transfer; IC package; Natural convection; Numerical analysis; Parallel plates

Indexed keywords

HEAT CONDUCTION; INTEGRATED CIRCUITS; NATURAL CONVECTION; NAVIER STOKES EQUATIONS; NUMERICAL ANALYSIS; NUSSELT NUMBER; TEMPERATURE; THREE DIMENSIONAL;

GRASHOF NUMBER; HEAT SOURCES; VERTICAL PARALLEL PLATES;

HEAT TRANSFER;

CONVECTION; HEAT TRANSFER; NAVIER-STOKES EQUATIONS; PLATES-PARALLEL;

EID: 0030266306     PISSN: 0142727X     EISSN: None     Source Type: Journal    
DOI: 10.1016/0142-727X(96)00051-3     Document Type: Article

References (18)

1. Aihara, T. 1973. Effects of inlet boundary conditions on numerical solutions of free convection between vertical parallel plates. Rpts. Inst. High Speed Mech., Tohoku Univ., 28, 1-27
2. Aung, W. 1972. Fully developed laminar free convection between vertical plates heated asymmetrically. Int. J. Heat Mass Transfer, 15, 1577-1580
3. Aung, W., Fletcher, L. S. and Sernas, V. 1972. Developing laminar free convection between vertical flat plates with asymmetric heating. Int. J. Heat Mass Transfer, 15, 2293-2308
4. Bar-Cohen, A. and Rohsenow, W. M. 1984. Thermally optimum spacing of vertical, natural convection cooled, parallel plates. J. Heat Transfer, 106, 116-123
5. Beckermann, C., Smith, T. F. and Pospichal, B. 1994. Use of a two-dimensional simulation model in the thermal analysis of a multi-board electronic module. J. Electronic Packaging, 116, 126-133
6. Bodoia, J. R. and Osterle, J. F. 1962. The development of free convection between heated vertical plates. J. Heat Transfer, 84, 40-44
7. Fujii, M. and Tomimura, T. 1988. Study on natural air cooling of IC board. Proc. First KSME-JSME Thermal and Fluids Engineering Conference, 2, 330-335
8. Fujii, M., Tomimura, T., Gima, S. and Zhang, X. 1992. An experimental study of natural convection heat transfer from vertical parallel boards. In Transport Phenomena Science and Technology, B. X. Wang (ed.), Higher Education Press, Beijing, China, 153-158
9. Fujii, M., Tomimura, T., Zhang, X. and Gima, S. 1994a. An experimental study of natural convection from an array of vertical parallel plates. Heat Transfer - Japan. Research, 23, 116-127
10. Fujii, M., Tomimura, T., Zhang, X. and Gima, S. 1994b. Natural convection from an array of vertical parallel plates. Proc. 10th International Heat Transfer Conference, 7, 49-54
11. Incropera, F. P. 1988. Convection heat transfer in electronic equipment cooling. J. Heat Transfer, 110, 1097-1111
12. Kim, S. H., Anand, N. K. and Fletcher, L. S. 1991. Free convection between series of vertical parallel plates with embedded line heat sources. J. Heat Transfer, 113, 108-115
13. Miyatake, O. and Fujii, T. 1974. Natural convective heat transfer between vertical parallel plates with unequal heat fluxes. Heat Transfer - Japan. Research, 3, 29-33
14. Modern Plastics Encyclopedia (MPE). 1985. 62, 448-480
15. Nakayama, W. and Hirooka, Y. 1986. Natural convection cooled boards with different power loadings and IC package arrangements. Proc. 23rd National Heat Transfer Symposium, Japan (in Japanese), 406-408
16. Sparrow, E. M. and Gregg, J. L. 1956. Laminar free convection from a vertical plate with uniform surface heat flux. Trans. ASME, 78, 435-440
17. Tomimura, T. and Fujii, M. 1988. Laminar mixed convection heat transfer between parallel plates with localized heat sources. In Cooling Technology for Electronic Equipment, W. Aung (ed.), Hemisphere Publishing Corporation, 233-247
18. Webb, B. W. and Hill, D. P. 1989. High Rayleigh number laminar natural convection in an asymmetrically heated vertical channel. J. Heat Transfer, 111, 649-656