Effects of oxide additives on sheet resistance of W thick-film conductor

Journal of Materials Science

Volumn 31, Issue 19, 1996, Pages 5159-5161

  Liang, Tongxiang ^a   Sun, Wenzhen ^a   Wang, Y H ^a   Li, H D ^a   Wu, Q L ^a   Yan, Y J ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ALUMINUM COMPOUNDS; CONDUCTIVE FILMS; ELECTRIC RESISTANCE; OXIDES; SINTERING; TUNGSTEN;

ALN-W SHEETS; OXIDE ADDITIVES; SHEET RESISTANCE;

NITRIDES;

EID: 0030261693     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00355919     Document Type: Article

References (4)

1. YASUHIRO KUROKAWA, CETIN TOY and W. D. SCOTT, J. Am. Ceram. Soc. 72 (1989) 612.
2. Y. H. CHIAO and K. YANG, in Cofire Metallization of Aluminum Nitride Substrates, ISHM '92 Proceedings 19-21 October 1992, San Francisco, CA, pp. 88-93.
3. J. C. SCHUSTER and H. NOWOTNY, J. Mater. Sci. 20 (1985) 2787.
4. A. GRANON, P. GOEURIOT and F. THEVENOT, in J. Europ. Ceram. Soc. 13 (1994) 365.