A new process for producing a granular material

Materials Science and Engineering: A

Volumn 217-218, Issue , 1996, Pages 232-234

  Ishii, K ^a   Ohba, T ^b   Hara, T ^b  

^a UTSUNOMIYA UNIVERSITY   (Japan)

^b TEIKYO UNIVERSITY   (Japan)

Author keywords

Gas flow sputtering technique; Granular material; Transmission electron microscopy

Indexed keywords

DEPOSITION; METALLIC FILMS; NICKEL ALLOYS; SILVER; SPUTTERING; TRANSMISSION ELECTRON MICROSCOPY; VAPORS;

GAS FLOW SPUTTERING TECHNIQUE; GRANULAR FILM;

GRANULAR MATERIALS;

EID: 0030260962     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(96)10276-8     Document Type: Article

References (10)

1. A.E. Berkowitz, J.R. Mitchell, M.J. Carey, A.P. Young, S. Zhang, F.E. Spada, E.T. Parker, A. Hutten and G. Thomas, Phys. Rev. Lett., 68 (1992) 3745.
2. J.Q. Xiao, J.S. Jiang and C.L. Chien, Phys. Rev. Lett., 68 (1992) 3749.
3. D.J. Lockwood, Solid State Commun., 92 (1994) 101.
4. J.R. Childress, C.L. Chien and M. Nathan, Appl. Phys. Lett., 56 (1990) 95.
5. C.L. Chien, J.Q. Xiao and J.S. Jiang, J. Appl. Phys., 73 (1993) 5309.
6. K. Ishii, M. Gotou, Y. Mori, T. Ohba and T Hara, Proc. 1st Magneto-Electronics Int. Symp., Nagano, Japan, Nov. 9-11, 1994, Shinshu University Press, Nagano, 1994, p. 109.
7. K. Ishii, J. Vac. Sci. Technol., A7 (1989) 256.
8. K. Ishii, Proc. 2nd Int. Symp. on Sputtering and Plasma Processes, Tokyo, Japan, May 27-28, 1993, ISSP'93 Committee, Tokyo, 1993, p. 227.
9. H. Haberland, M. Karrais, M. Mall and Y. Thurner, J. Vac. Sci. Technol., A10 (1992) 3266.
10. K. Ishii and S. Handa, Appl. Surf. Sci., 33/34 (1988) 1107.