Effect of grain size on high-temperature creep behavior of γ-Ti-53 mol%Al intermetallics in the low stress region

Materials Transactions, JIM

Volumn 37, Issue 10, 1996, Pages 1607-1610

  Hamada, N ^a,b   Oikawa, H ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b AICHI STEEL CORPORATION   (Japan)

Author keywords

Grain size effect; High temperature creep; Low stress; Minimum creep rate; Polycrystals; TiAl

Indexed keywords

BINARY ALLOYS; CREEP; CREEP TESTING; GRAIN SIZE AND SHAPE; HIGH TEMPERATURE PROPERTIES; INTERMETALLICS; POLYCRYSTALS; STRAIN; STRESS ANALYSIS;

MINIMUM CREEP RATE;

TITANIUM ALLOYS;

EID: 0030260250     PISSN: 09161821     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans1989.37.1607     Document Type: Article

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