Cu films deposited by a partially ionized beam (PIB)

Thin Solid Films

Volumn 287, Issue 1-2, 1996, Pages 266-270

  Koh, Seok Keun ^a   Choi, Won Kook ^a   Kim, Ki Hwan ^a   Jung, Hyung Jin ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

Adhesion; Copper; Deposition process; Resistivity

Indexed keywords

ADHESION; ANNEALING; CHEMICAL VAPOR DEPOSITION; COPPER; CURRENT DENSITY; ELECTRIC CONDUCTIVITY OF SOLIDS; ION BEAMS; IONIZATION OF SOLIDS; SILICA; SUBSTRATES; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

ACCELERATION VOLTAGES; COPPER THIN FILMS; ELECTRON EMISSION CURRENT; ION BEAM CURRENT DENSITY; PARTIALLY IONIZED BEAM (PIB); SILICON SUBSTRATES;

METALLIC FILMS;

EID: 0030259981     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)08739-1     Document Type: Article

References (18)

1. M.B. Small and D.J. Pearson, IBM J. Res. Dev., 34 (1990) 858.
2. C.C. Lee, E.S. Machlin and H. Rathore, J. Appl. Phys., 71 (1992) 5877.
3. W.M. Holber, J.S. Logan, H.J. Grabarz, T.C. Yeh and J.B.O. Caughman, J. Vac. Sci. Technol., A11 (1993) 2903.
4. G. Doyle, K.A. Ericksen and D. Van Eugen, Organometallics, 4 (1985) 830.
5. M.F. Richardson and R.E. Sievers, Inorg. Chem., 10 (1971) 498.
6. A.V. Gelatos, A. Jain, R. Marsh and C.J. Mogab, Mater. Res. Soc. Bull., XIX (8) (1994) 49.
7. R.W. Moshier, R.E. Sievers and L.B. Spendlove, US Patent No. 3,356,527, 1964.
8. S.K. Koh, J. Lee, Z. Jin and H.-J. Jung, New Phys., 34 (6) (1994) 713.
9. T. Takagi, Ionized Cluster Beam Deposition and Epitaxy Noyes publication, New Jersey, 1988.
10. S.K. Koh, Z. Jin, J. Lee, H.-J. Jung, K.H. Kim and D.-J. Choi, J. Vac. Sci. Technol. A13 (4) (1995) 2123.
11. K. Yano, S.H. Be, H. Enjojima and K. Okamoto, Jpn. J. Appl. Phys., 14 (1975) 526.
12. S.Q. Wang, Mater. Res. Soc. Bull., XIX (8) (1994) 30.
13. K. Ohno, M. Sato, and Y. Arita, Proc. Symp. Interconnect, Contact Metallization, Multilevel Metalization, The Electrochemical Society, New York, 1993, p. 316.
14. T. Ohmi et al., J. Electrochem. Soc., 138 (4) (1991) 1089.
15. D.S. Perloff et al., Solid State Electron., 20 (1977) 681.
16. J. Harper, E. Colgan, C. Hu, J. Hummel, L. Buchwalter and C. Uzoh, Mater. Res. Soc. Bull., XIX (8) (1994) 23.
17. A.E. Mayadas and M. Shatzkes, Phys. Rev., B1 (1970) 1382.
18. C. Kittel, Introduction to Solid State Physics, Wiley, New York, 3rd edn., 1966, p. 217.