Surface insulation resistance methodology for today's manufacturing technology

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 4, 1996, Pages 300-306

  Chan, H Anthony ^a  

^a AT AND T LABS RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE MEASUREMENT; ELECTROCHEMICAL CORROSION; IMPURITIES; IONS; PRINTED CIRCUIT BOARDS; RELIABILITY;

DIRECT CURRENT (DC) CONTINUOUS MEASUREMENT; LOW SOLIDS FLUXES (LSF); PRINTED CIRCUIT ASSEMBLY; SURFACE INSULATION RESISTANCE (SIR);

PRINTED CIRCUIT MANUFACTURE;

EID: 0030258629     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.558559     Document Type: Article

References (7)

1. L. A. Guth To clean or not to clean? Circuits Manufact. 59 Feb. 1989
2. W. Rubin M. Warwick A no-clean-flux review Surf. Mount Tech. 42 Oct. 1990
3. E. J. Gorondy Surface insulation resistance̵Part I: The development of an automated SIR measurement technique IPC-TP-518 Institute for Interconnecting and Packaging Electronic Circuits
4. K. M. Takahashi AC impedance measurements of moisture in interfaces between epoxy and oxidized silicon J. Appl. Phys. 67 3419 1990
5. W. B. Wargotz technical memo
6. Generic physical design requirements for telecommunications products and equipment Bellcore Tech. Ref TR-TSY-000078 1988
7. K. M. Takahashi T. M. Sullivan AC impedance measurement of environmental water in adhesive interfaces J. Appl. Phys. 66 3192 1989