Robust metric for measuring within-wafer uniformity

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 4, 1996, Pages 283-289

  Davis, Joseph C ^a   Gyurcsik, Ronald S ^a   Lu, Jye Chyi ^a   Hughes Oliver, Jacqueline M ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ESTIMATION; SEMICONDUCTOR DEVICE TESTING; STATISTICAL METHODS;

INTEGRATION STATISTIC METHOD; SEMICONDUCTOR WAFERS; WITHIN WAFER UNIFORMITY ANALYSIS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0030257359     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.558556     Document Type: Article

References (6)

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3. I. Ali S. R. Roy G. Shinn Chemical-mechanical polishing of interlayer dielectric: A review Solid State Technol. Oct. 1994
4. R. A. Becker J. M. Chambers A. R. Wilks The New S Language: A Programming Environment for Data Analysis and Graphics. 1988
5. J. C. Davis R. S. Gyurcsik J. C. Lu R. H. Perkins Application of modern quality improvement techniques to rapid thermal processing Proc. Rapid Thermal Integrated 1595 Sept. 1991 SPIE CA, San Francisco
6. Green Silverman Non-parametric Regression and Generalized Linear Models. 1994 Chapman and Hall U.K., London