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Volumn 29, Issue 9, 1996, Pages 68-72
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Moisture curable wire and cable compounds: a comparison with E-beam and CV processing
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
CABLES;
CATALYSTS;
CHEMICAL BONDS;
CROSSLINKING;
CURING;
ELECTRIC CABLES;
ELECTRIC WIRE;
EXTRUSION;
LOW DENSITY POLYETHYLENES;
MOISTURE;
SILANES;
THERMOPLASTICS;
MITSUBISHI METHOD;
MOISTURE CURABLE WIRE;
MONOSIL PROCESS;
SIOPLAS METHOD;
WATER CURING;
WIRE PRODUCTS;
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EID: 0030247340
PISSN: 02774275
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (5)
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References (0)
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