Dymalloy: A composite substrate for high power density electronic components

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 3, 1996, Pages 206-210

  Kerns, John A ^a   Colella, Nicholas J ^a   Makowiecki, Daniel ^a   Davidson, Howard L ^b  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^b SUN MICROSYSTEMS   (United States)

Author keywords

Composite Material; Copper Diamond Composite Substrate; Diamond Composite; Package Base; Thermal Conductivity

Indexed keywords

BONDING; COMPONENTS; COMPOSITE MATERIALS; COPPER; DIAMONDS; MECHANICAL PROPERTIES; MULTICHIP MODULES; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

COMPOSITE SUBSTRATES; COPPER DIAMOND COMPOSITE; DYMALLOY; HIGH POWER DENSITY ELECTRONIC COMPONENTS; JUNCTION TEMPERATURE;

ELECTRONICS PACKAGING;

EID: 0030246655     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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