TLM treatment of a general diffusion flux boundary condition

International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

Volumn 9, Issue 5, 1996, Pages 327-333

  Gui, Xiang ^a,b,c,d,e   Dew, Steven K ^a,f,g   Brett, Michael J ^a,f,g,h  

^a UNIVERSITY OF ALBERTA   (Canada)

^b UNIVERSITY OF CALGARY   (Canada)

^c BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^d UNIVERSITY OF BIRMINGHAM   (United Kingdom)

^e University of Illinois at Urbana Champaign   (United States)

^f UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^g Alberta Microelectronic Centre

^h QUEEN S UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; COMPUTER SIMULATION; MATRIX ALGEBRA; NUMERICAL METHODS; TRANSMISSION LINE THEORY;

CURRENT CONTROLLED VOLTAGE SOURCE; DIFFUSION COEFFICIENT; DIFFUSION MODELLING; MATCHED LOAD BOUNDARY; TRANSMISSION LINE MATRIX;

CIRCUIT THEORY;

EID: 0030244611     PISSN: 08943370     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1204(199609)9:5<327::AID-JNM238>3.0.CO;2-B     Document Type: Article

References (8)

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5. D. de Cogan and M. Henini, "TLM modelling of the thermal behaviour of conducting films on insulating substrates", J. Phys. D: Appl. Phys., 20, 1445-1450 (1987).
6. D. de Cogan and P. Enders, "Discrete Green's functions and hybrid modelling of thermal and particle diffusion", Int. J. Numer. Model.: Electron. Netw. Devices Fields, 7, 407-418 (1994).
7. X. Gui, L. J. Friedrich, S. K. Dew, M. J. Brett and T. Smy, "Grain-boundary diffusion modeling and efficiency evaluation of thin-film diffusion barriers considering microstructure effects", J. Appl. Phys. 78, 4438-4443 (1995).
8. X. Gui, L. J. Friedrich, S. K. Dew, M. J. Brett and T. Smy, "TLM modelling of grain-boundary diffusion in thin films with microstructural details", in Proceedings of the 1st International Workshop on TLM modelling - Theory and Applications, University of Victoria, Victoria, BC, Canada, Aug. 1995, pp. 129-132.