Evaporation cooling of high power electronic devices

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 3, 1996, Pages 431-434

  Dulnev, Gennady N ^a   Korablyev, Vladimir A ^a   Sharkov, Alexander V ^a  

^a ITMO UNIVERSITY   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

COOLANTS; COOLING; DIELECTRIC MATERIALS; EVAPORATION; HEAT LOSSES; HEAT TRANSFER; HEATING EQUIPMENT;

DIELECTRIC COOLANT; HEAT TRANSFER CRISIS; POWER SEMICONDUCTOR DEVICES;

SEMICONDUCTOR DEVICES;

EID: 0030243865     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.536845     Document Type: Article

References (10)

1. A. I. Isakeev, I. G. Kiselyev, and V. V. Filatov, "Effective methods of power semiconductor devices cooling," Energoatomizdat, 1982.
2. "Air, liquid, and evaporation cooling of power semiconductor and transforming apparatus, based on the above cooling," All-Union Conf., 1982.
3. S. A. Tiktin, "Vapotronic devices," Technica, 1975.
4. V. A. Volohov, V. E. Khrichikov, and V. I. Kiselyov, "Cooling systems of heat loaded radioelectronic apertures," Soviet Radio, 1975.
5. Z. I. Guyno, Ed., Theoretical Basis of Heat and Cooling Equipment, Part 2, Heat Transfer, Leningrad, USSR: Leningrad University Press, 1976.
6. S. S. Kutateladze, "Basis of heat transfer," Atomizdat, 1979.
7. D. Kern and A. Kraus, Developing Heat Exchanger Surface. Moscow, USSR: Energiya Press, 1977.
8. R. I. Roysen and I. N. Dulkin, Heat Regime of Ribbed Surfaces. Moscow, Russia: Energiya Press, 1977.
9. M. Monde, H. Kusuda, and H. Uehara, "Critical heat flux during natural convective boiling in vertical rectangular channels submerged in saturated liquid," Amer. Soc. Mech. Eng., vol. 104, no. 2, 1982.
10. Cshveyitzer Barr-Koen, "Boiling in vertical channels under natural circulation," Trans. ASME J. Heat Transfer, vol. 107, no. 5, Feb. 1985.