Thermal modeling of electrical contacts in switches and relays

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 3, 1996, Pages 346-352

  Leung, Chi H ^a,b   Lee, Anthony ^a,c   Wang, Bor Jenq ^c  

^a IEEE

^b GENERAL MOTORS CORPORATION   (United States)

^c Delphi Packard Electric Systems   (United States)

Author keywords

Finite difference method; Relay; Switch; T SNAP; Thermal model; Thermal network

Indexed keywords

CALCULATIONS; ELECTRIC RELAYS; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; HEAT RESISTANCE; MATHEMATICAL MODELS; SWITCHES; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMOANALYSIS; THREE DIMENSIONAL;

FINITE DIFFERENCE THERMAL ANALYSIS; THERMAL NETWORK FINITE DIFFERENCE ANALYSIS TECHNIQUE;

ELECTRIC CONTACTS;

EID: 0030243151     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.536836     Document Type: Article

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