Healing of fractured polymers by interdiffusion

Polymer

Volumn 37, Issue 20, 1996, Pages 4593-4597

  Kim, H J ^a   Lee, Ki Jun ^a   Lee, Hong H ^a  

^a Seoul National University   (South Korea)

Author keywords

Fracture toughness; Healing process; Interdiffusion

Indexed keywords

FRACTURE TOUGHNESS; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); MATHEMATICAL MODELS; MOLECULAR STRUCTURE; MONOMERS; RANDOM PROCESSES;

CHAIN SCISSION; FLAT CHAIN DISTRIBUTION; FRACTURED POLYMERS; HEALING PROCESS; MINOR CHAIN MODEL;

POLYMERS;

EID: 0030231314     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/0032-3861(96)00304-7     Document Type: Article

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