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Volumn 39, Issue 9, 1996, Pages
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Low cost laminate for wireless applications
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
DIELECTRIC PROPERTIES OF SOLIDS;
ELECTRIC PROPERTIES;
ELECTRONICS PACKAGING;
FREQUENCY RESPONSE;
MICROWAVE CIRCUITS;
RADIO COMMUNICATION;
THERMODYNAMIC PROPERTIES;
HIGH FREQUENCY CIRCUIT MATERIALS;
LAMINATES;
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EID: 0030223723
PISSN: 01926225
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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