Multireflection algorithm for timed statistical coupled noise checking

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 503-511

  Smith, Howard H ^b   Katopis, George A ^a,b  

^a IEEE

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; COMPUTER SOFTWARE; COUPLED CIRCUITS; ELECTRONICS PACKAGING; STATISTICAL METHODS;

COUPLED NOISE CHECKING SOFTWARE; REFLECTION COEFFICIENTS;

SPURIOUS SIGNAL NOISE;

EID: 0030216688     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533888     Document Type: Article

References (7)

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2. P. N. Venkatachalam, H. Smith, and R. Rippens, "Noise containment in a high wiring density multichip module," in Proc. 2nd Top. Meeting Electr. Performance Electron. Packag., Oct. 1993, pp. 56-58.
3. D. Rude, "Statistical method of noise estimation in a synchronous system," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 17, pp. 514-519, Nov. 1994.
4. A. Feller, H. R. Kaup, and J. J. Digiacomo, "Crosstalk and reflection in high speed digital systems," in AFIPS Conf. Proc. Fall JT Computer Conf., 1965, vol. 27, pp. 511-525.
5. G. A. Katopis and H. Smith, "Coupled noise predictors for lossy interconnects," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 17, pp. 520-524, Nov. 1994.
6. E. Davidson, P. Harding. G. Katopis, M. Nealon, and L. Wu, "Physical and electrical design features of the IBM enterprise system/9000 circuit module," IBM J. Res. Dev., vol. 36, no. 5, pp. 277-288, Sept. 1992.
7. B. J. Rubin, "An electromagnetic approach for modeling high performance computer packages," IBM J. Res. Dev., pp. 585-599, July 1990.