The effect of bonding wires on longitudinal temperature profiles of laser diodes

Journal of Lightwave Technology

Volumn 14, Issue 8, 1996, Pages 1847-1852

  Lee, Chin C ^a,b,c,d,e,f   Chien, David H ^a,b,g  

^a IEEE

^b UNIVERSITY OF CALIFORNIA   (United States)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^d CARNEGIE MELLON UNIVERSITY   (United States)

^e Dept of Elec and Comp Engineering ^*

^f Intl Society for Boundary Elecments

^g CALIFORNIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRODES; FINITE ELEMENT METHOD; HEAT SINKS; HEAT TRANSFER; ITERATIVE METHODS; SEMICONDUCTOR DEVICE STRUCTURES; SURFACES; THERMAL EFFECTS; WIRE;

BONDING WIRES; HEAT SOURCE; LONGITUDINAL TEMPERATURE PROFILE;

SEMICONDUCTOR LASERS;

EID: 0030216529     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/50.532022     Document Type: Article

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