Analytical and numerical predictions of dendritic grain envelopes

Acta Materialia

Volumn 44, Issue 8, 1996, Pages 3339-3347

  Gandin, Ch A ^a   Schaefer, R J ^b   Rappaz, M ^a  

^a EPFL   (Switzerland)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GRAIN GROWTH; MATHEMATICAL MODELS; METALS; NUMERICAL ANALYSIS; SOLIDIFICATION;

BRIDGMAN CONFIGURATION; CELLULAR AUTOMATION FINITE ELEMENT; DENDRITIC GRAIN GROWTH; SUCCINONITRILE-ACETONE ALLOYS; THERMAL GRADIENT;

CRYSTAL MICROSTRUCTURE;

EID: 0030215071     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6454(95)00433-5     Document Type: Article

References (13)

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