Ag effect on microstructures and strength of Si3N4/Si3N4 joint brazed with Cu-Ag-Ti filler metals

Journal of Materials Science Letters

Volumn 15, Issue 15, 1996, Pages 1353-1354

  Tamai, F ^a   Naka, M ^b  

^a Industrial Technology Center of Saga   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPOSITION EFFECTS; COPPER ALLOYS; INTERFACES (MATERIALS); JOINING; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; SILVER; STRENGTH OF MATERIALS; X RAY ANALYSIS;

COPPER SILVER TITANIUM FILLER METALS; ELECTRON PROBE MICROANALYSIS; FOUR POINT BENDING TEST; JOINING STRENGTH;

BRAZING FILLER METALS;

EID: 0030214870     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00240805     Document Type: Article

References (3)

1. M. SCHUWARTZ, "Ceramic joining" (American Society for Metals, Metals Park, Ohio, 1990).
2. E. LUGSCHEIDER, M. BORETIUS and W. TILLMANN, in "Designing with structural ceramics", edited by P. W. Davidge and M. H. VanDe Voorde (Elsevier Applied Science, Amsterdam, 1990) p. 204.
3. F. TAMAI and M. NAKA, J. Mater. Sci. 15 (1996) 1028.