Plant identification from leaves using quasi-sensor fusion

Journal of Manufacturing Science and Engineering, Transactions of the ASME

Volumn 118, Issue 3, 1996, Pages 382-386

  Shiraishi, M ^a   Sumiya, H ^a  

^a IBARAKI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; ASPECT RATIO; COLOR; COMPUTER VISION; DECISION MAKING; HARVESTING; INTELLIGENT ROBOTS; OBJECT RECOGNITION; PLANTS (BOTANY); SENSOR DATA FUSION;

CROPPING; DIMENSIONLESS IMAGE DETECTION; QUASI SENSOR FUSION; RADIUS PERMUTATION; THINNING; WEEDING;

IDENTIFICATION (CONTROL SYSTEMS);

EID: 0030214739     PISSN: 10871357     EISSN: 15288935     Source Type: Journal    
DOI: 10.1115/1.2831041     Document Type: Article

References (9)

1. Alden, C., Lichtensteiger, M. J., and Ullman, J. D., 1988. -Nursery Plant Dctcction and Assessment Using Image Analysis,— ASAE Paper. No. 88-3055. Benson, K. B., 1986. Television Engineering Handbook. McGraw-Hill.
2. Grand d’Esnon, A., 1985. -Robotic Harvesting of Apples,— ASAE/SME, pp. 210-214.
3. Ishizuka, T., 1993, -Plant Feature Identification from I.caf Profiles,— MS Thesis at Ibaraki University.
4. Li, S., and Elbestawi, M. A., 1992, -A RlZZy Logic Approach for Multi-Sensor Process Monitoring in Machining,— ASME PED-Vol. 55. pp. 1-16.
5. Meyer, G. E., and Davison, D A., 1987, -An Electronic Image Plant Growth Measurement System,— Trans. ASAE. Vol. 30. No. 1. pp. 242-248.
6. Rangwala, S., and Domfeld, D., 1990, -Sensor Integration Using Neural Network for Intelligent Tool Condition Monitoring.— Trans ASME. Vol. 112. No. 3, pp. 219-226.
7. Rong, Y., Fang, M., Tzou, H. S., and Grover, W. A., 1991, -Monitoring and Diagnosis of Robin Operation through Vibration Signal Analysis,— ASME WAM. ASME-91-DSC.
8. Simonton, W., and Pease, J., 1990, -Automatic Plant Feature Identification on Geranium Cuttings Using Machine Vision.— Trans. ASAE. Vol. 33, No 6. pp. 2067-2073.
9. Shiraishi, M., 1992. -What Will Be Expected for Sensor Fusion and Quasi sensor Fusion in Manufacturing—” Proc. of 3rd Int. Conf. on High Technology. Chiba, Japan. OA-7, pp. 85-90.