Stress and induction field of a spheroidal inclusion or a penny-shaped crack in a transversely isotropic piezo-electric material

International Journal of Solids and Structures

Volumn 33, Issue 19, 1996, Pages 2719-2737

  Kogan, L ^a   Hui, C Y ^a   Molkov, V ^b  

^a Department of Obstetrics Gynecology   (United States)

^b MOSCOW STATE UNIVERSITY   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTRIC FIELD EFFECTS; INCLUSIONS; LOADS (FORCES); NUMERICAL METHODS; STRESS ANALYSIS; STRESS INTENSITY FACTORS; STRESSES;

ELECTRICAL LOADING; EXACT CLOSED FORM SOLUTIONS; INDUCTION FIELD; INDUCTION INTENSITY FACTORS; MECHANICAL LOADING;

PIEZOELECTRIC MATERIALS;

EID: 0030214094     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/0020-7683(95)00182-4     Document Type: Article

References (23)

1. Bose, S. C. (1965). On the torsion of a transversely isotropic circular cylinder having a small spherical elastic inclusion of an isotropic material. Z. Angew. Math. Mech. 45, 133-135.
2. Chen, W. T. (1968). Axisymmetric stress field around spheroidal inclusions and cavities in a transversely isotropic material. J. Appl. Mech. 35, 770-773.
3. Chen, W. T. (1970). Stress concentration around spheroidal inclusions and cavities in a transversely isotropic material under pure shear. J. Appl. Mech. 37, 85-92.
4. Christensen, R. M. (1979). Mechanics of Composite Materials. Wiley-Interscience, New York.
5. Deeg, W. F. (1980). The analysis of the dislocation, crack, and inclusion problems in piezoelectric solids. Ph.D. Thesis, Stanford University, Stanford, CA.
6. Dunn, M. L. and Taya. M. (1993). Electromechanical properties of porous piezoelectric ceramics. J. Am. Ceram. Soc. 76, 1697-1706.
7. Elliot, H. A. (1948). Three-dimensional stress distributions in hexagonal aelotropic crystals. Proc. Cambridge Philos. Soc. 44, 522-533.
8. Eshelby, J. D. (1957). The determination of the elastic field of an ellipsoidal inclusion, and related problems. Proc. R. Soc. A241, 376-396.
9. Goodier, J. N. (1933). Concentration of stress around spherical and cylindrical inclusions and flows. ASME Trans. 55, 39-44.
10. Hoenig, A. (1978). The behavior of a flat elliptical crack in an anisotropic elastic body. Int. J. Solids Structures 14, 925-934.
11. Kassir, M. K. (1968). Three-dimensional stress around elliptical cracks in transversely isotropic solids. Engng Fracture Mech. 1, 327-345.
12. Lurie, A. T. (1952). The state of stress around an ellipsoidal cavity. Dokl. Akad. Nauk. 87, 709-710.
13. Mura, T. (1974). Thin inclusions and cracks in anisotropic media. J. Appl. Mech. 41, 209-224.
14. Mura, T. (1976). The elastic field caused by a general ellipsoidal inclusion and the application to martensite formation. J. Mech. Phys. Solids 24, 305-318.
15. Pak, Y. E. (1990). Crack extension force in a piezoelectric material. J. Appl. Mech. 57, 647-653.
16. Sadowsky, M. A. (1947). Stress concentration around an ellipsoidal cavity in an infinite body under arbitrary plane stress perpendicular to the axis of revolution of cavity. ASME Trans. 69, A191-201.
17. Shield, R. T. (1951). Notes on problems in hexagonal aerolotropic materials. Proc. Cambridge Philos. Soc. 47, 401-409.
18. Sih, G. C. (1968). Mathematical theory of brittle fracture. In An Advanced Treatise on Fracture, Vol. 2 (Edited by H. Liebowitz), pp. 67-190. Academic Press.
19. Suo, Z. (1993). Models for breakdown-resistant dielectric and ferroelectric ceramics. J. Mech. Phys. Solids 41, 1155-1176.
20. Wang, B. (1992a). Three-dimensional analysis of an ellipsoidal inclusion in a piezoelectric material. Int. J. Solids Structures 29, 293-308.
21. Wang, B. (1992b). Three-dimensional analysis of a flat elliptical crack in a piezoelectric material. Int. J. Engng Sci. 30, 781-791.
22. Willis, J. R. (1968). The stress field around an elliptical crack in an anisotropic medium. Int. J. Engng Sci. 6, 253-263.
23. Willis, J. R. (1977). Bounds on self-consistent estimates for the overall properties of anisotropic composites. J. Mech. Phys. Solids 25, 185-202.