Low temperature bonding of epitaxial lift off devices with AuSn

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 575-580

  Dohle, G Rainer ^a   Drabik, Timothy J ^a   Callahan, John J ^a   Martin, Kevin P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bonding; Epitaxial lift off; Gold tin; Optoelectronic and microwave devices

Indexed keywords

BONDING; GOLD ALLOYS; LATTICE CONSTANTS; MICROWAVE DEVICES; MULTILAYERS; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; X RAY ANALYSIS;

BONDING MATERIALS; EPITAXIAL LIFT OFF DEVICES; SURFACE ANALYSIS TECHNIQUES;

INTEGRATED OPTOELECTRONICS;

EID: 0030213674     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533898     Document Type: Article

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