Studies of platinum electroplating baths part IV: Deposits on copper from Q bath

Journal of Applied Electrochemistry

Volumn 26, Issue 8, 1996, Pages 873-880

  Basirun, W J ^a   Pletcher, D ^a   Saraby Reintjes, A ^a  

^a UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CYCLIC VOLTAMMETRY; ELECTROPLATING; ELECTROPLATING SOLUTIONS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY;

CONTROLLED POTENTIAL; ELECTROPLATING BATHS; HIGH CURRENT EFFICIENCY; POTENTIAL STEP METHODS;

PLATINUM;

EID: 0030213418     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00683750     Document Type: Article

References (4)

1. Johnson Matthey Materials Technology Division, European Patent 358 375.
2. P. E. Skinner, Plat. Metals Rev. 33 (1989) 102.
3. R. Le Penven, W. Levason and D. Pletcher, J. Appl. Electrochem. 22 (1992) 415.
4. A. J. Gregory, R. Le Penven, W. Levason, R. E. Noftle and D. Pletcher, J. Electroanal. Chem., 399 (1995) 105.