A study of the wetting, microstructure and bond strength in brazing SiC by Cu-X(X = Ti,V,Nb,Cr) alloys

Journal of Materials Science

Volumn 31, Issue 15, 1996, Pages 4133-4140

  Lee, Hyoung Keun ^a   Lee, Jai Young ^b  

^a Korea Institute of Machine and Materials   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); COPPER ALLOYS; DECOMPOSITION; INTERFACES (MATERIALS); MECHANICAL TESTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; WETTING;

BRAZED JOINTS; BRAZING ALLOYS; ENERGY DISPERSIVE X RAY SPECTROMETRY; FOUR POINT BEND TEST; WETTING ANGLE;

BRAZING;

EID: 0030212767     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00352679     Document Type: Article

References (9)

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