A full-wave characterization of an interconnecting line printed on a dielectric slab backed by a gridded ground plane

IEEE Transactions on Electromagnetic Compatibility

Volumn 38, Issue 3, 1996, Pages 237-243

  Bernardi, Paolo ^a,b   Cicchetti, Renato ^a,b   Faraone, Antonio ^b  

^a IEEE

^b SAPIENZA UNIVERSITY OF ROME   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; DIELECTRIC MATERIALS; DIGITAL INTEGRATED CIRCUITS; ELECTRIC PROPERTIES; ELECTRIC WIRING; GEOMETRY; MATHEMATICAL MODELS; MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTOR DEVICE STRUCTURES;

ELECTRODYNAMIC MODEL; GRIDDED GROUND PLANE; SPECTRAL DOMAIN APPROACH;

ELECTRIC LINES;

EID: 0030212716     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/15.536052     Document Type: Article

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