High Q-factor inductors integrated on MCM Si substrates

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 635-642

  Zu, Larry ^b   Lu, Yicheng ^a,c   Frye, Robert C ^a,d   Lau, Maureen Y ^d   Chen, Sheue Chyn Sandy ^d   Kossives, Dean P ^d   Lin, Jenshan ^a,d   Tai, King L ^d  

^a IEEE

^b HEWLETT PACKARD COMPANY   (United States)

^c RUTGERS UNIVERSITY   (United States)

^d LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CAPACITANCE; COMPUTER AIDED ANALYSIS; COMPUTER SIMULATION; DIELECTRIC MATERIALS; INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; POLYIMIDES; SEMICONDUCTING SILICON; SKIN EFFECT; SUBSTRATES; THIN FILMS;

ELECTROMAGNETIC SIMULATION TOOLS; PARASITIC COUPLING CAPACITANCE; QUALITY FACTOR; SILICON SUBSTRATES;

ELECTRIC INDUCTORS;

EID: 0030212710     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533907     Document Type: Article

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