Measurements of the novel thermal conduction of a porphoritic heat sink paste

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 601-604

  Artus, Raymonde G C ^a,b  

^a IEEE

^b UNIVERSITY OF READING   (United Kingdom)

Author keywords

Heat sink; MCM; Thermal conduction; Thermal management of die

Indexed keywords

HEAT CONDUCTION; HEAT LOSSES; HEAT SINKS; MULTICHIP MODULES; SEMICONDUCTING DIAMONDS; THERMAL VARIABLES MEASUREMENT;

PORPHORITIC HEAT SINK MATERIAL; THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0030212709     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533902     Document Type: Article

References (6)

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5. W. Jobst, Int. J. Heat Mass Transfer, vol. 7, pp. 725-732, 1964.
6. J. Maddox, "Classical liquid in a box," Nature, vol 350, p. 105, Mar. 1991.