The spreading kinetics of Ag-28Cu(L) on nickel(S): Part I. Area of spread tests on nickel foil

Journal of Materials Research

Volumn 11, Issue 8, 1996, Pages 1897-1916

  Weirauch Jr , Douglas A ^a   Krafick, William J ^a  

^a ALCOA TECHNICAL CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; FILLER METALS; FLOW OF SOLIDS; GRAIN BOUNDARIES; METAL FOIL; MICROSCOPIC EXAMINATION; NICKEL; PHASE INTERFACES; SOLIDIFICATION; SURFACE ROUGHNESS; THERMAL EFFECTS;

BREAKOUT FLOW; DYNAMIC HOT STAGE MICROSCOPY; NONREACTIVE FLOW; SECONDARY SPREADING; SESSILE DROP EXPERIMENTS; SPREADING KINETICS;

SILVER ALLOYS;

EID: 0030211919     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1996.0241     Document Type: Article

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