Evaluation on a two-day time scale of high-reliability electronic assemblies by in-situ electrical and opto-mechanical test techniques

Quality and Reliability Engineering International

Volumn 12, Issue 4, 1996, Pages 247-252

  Gregoris, G ^a   Bouton, F ^a   De Keukeleire, C ^a   Siliprandi, P ^a   Baio, F ^a   De Schepper, L ^a   De Ceuninck, W ^a   Tielemans, L ^a   Ahrens, T ^a   Krumm, M ^a  

^a THALES ALENIA SPACE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; IN SITU PROCESSING; MARKETING; QUALITY ASSURANCE; SPECIFICATIONS; STRESSES;

ELECTRONIC ASSEMBLY; IN SITU ELECTRICAL TEST TECHNIQUE; IN SITU OPTO MECHANICAL TEST TECHNIQUE; SHORT DURATION TEST;

RELIABILITY;

EID: 0030197271     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1638(199607)12:4<247::AID-QRE22>3.0.CO;2-O     Document Type: Article

References (5)