Reliability issues in hybrid optoelectronic interconnect systems

Quality and Reliability Engineering International

Volumn 12, Issue 4, 1996, Pages 329-334

  Pusarla, Chandrasekhar ^a   Lin, Ling ^a   Christou, Aris ^a,b,c,d,e,f  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c UNIVERSITY OF PENNSYLVANIA   (United States)

^d Englewood Health

^e NAVAL RESEARCH LABORATORY   (United States)

^f IEEE

Author keywords

Bonding; Finite elements; Flip chip; Optical beams; Optical interconnects

Indexed keywords

APPROXIMATION THEORY; BONDING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PERFORMANCE; PHOTODIODES; RELIABILITY; SOLDERING; THERMAL EXPANSION;

FLIP CHIP BOND; GAUSSIAN BEAM PROPAGATION MODEL; LOW CYCLE THERMAL FATIGUE; MICROLENS; OPTICAL BEAMS; SIGNAL TIME DELAY;

OPTICAL INTERCONNECTS;

EID: 0030197267     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/(sici)1099-1638(199607)12:4<329::aid-qre25>3.0.co;2-i     Document Type: Article

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