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Volumn 12, Issue 4, 1996, Pages 305-308

Electromigration of interconnects of a TiN/Cu/TiN/Ti structure

Author keywords

Activation energy; Copper; Interconnection; Reliability

Indexed keywords

ACTIVATION ENERGY; ANNEALING; COPPER; CURRENT DENSITY; DIFFUSION; ELECTRIC WIRING; GRAIN BOUNDARIES; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MAGNETRON SPUTTERING; RELIABILITY; TITANIUM NITRIDE;

EID: 0030197266     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/(sici)1099-1638(199607)12:4<305::aid-qre41>3.0.co;2-1     Document Type: Article
Times cited : (2)

References (9)
  • 3
    • 0023849056 scopus 로고
    • Kinetic study of electromigration failure in Cr/al-Cu thin film conductors covered with plyimide and the problem of the stress dependent activation energy
    • J. R. Lloyd, M. Shatzkes and C. Challener, 'Kinetic study of electromigration failure in Cr/al-Cu thin film conductors covered with plyimide and the problem of the stress dependent activation energy', IRPS, 1988, pp. 216-225.
    • (1988) IRPS , pp. 216-225
    • Lloyd, J.R.1    Shatzkes, M.2    Challener, C.3
  • 4
    • 5844290718 scopus 로고
    • EM-induced failures in VLSI interconnects
    • Krishna Shenai (ed.), Texas Instruments Inc.
    • P. B. Gathe, 'EM-induced failures in VLSI interconnects', in Krishna Shenai (ed.), VLSI metallization: Phys. and Tech., Texas Instruments Inc., 1991.
    • (1991) VLSI Metallization: Phys. and Tech.
    • Gathe, P.B.1
  • 5
    • 0000323896 scopus 로고
    • Line width dependence of electromigration in evaporated Al-0·5%Cu
    • S. Vaidya, T. T. Sheng and A. K. Sinha, 'Line width dependence of electromigration in evaporated Al-0·5%Cu', Appl. Phys. Let., 36(6), 464-466 (1980).
    • (1980) Appl. Phys. Let. , vol.36 , Issue.6 , pp. 464-466
    • Vaidya, S.1    Sheng, T.T.2    Sinha, A.K.3
  • 7
    • 84937650904 scopus 로고
    • EM - A brief survey and some recent results
    • J. R. Black, 'EM - A brief survey and some recent results'. IEEE Trans. Electron Devices, ED16, 338 (1969).
    • (1969) IEEE Trans. Electron Devices , vol.ED16 , pp. 338
    • Black, J.R.1
  • 9
    • 5844229750 scopus 로고
    • Self-diffusion in solid elements
    • Butterworth Co.
    • 'Self-diffusion in solid elements', in Metals Reference Book (5th Edition), Butterworth Co., 1976, pp. 867-868.
    • (1976) Metals Reference Book (5th Edition) , pp. 867-868


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.