메뉴 건너뛰기




Volumn 39, Issue 3, 1996, Pages 291-296

Atomic mechanics simulation on nucleation process of grain boundary groove in aluminum conductor of microelectronic packages

Author keywords

Aluminum Conductor; Atomic Mechanics; Computational Mechanics; Grain Boundary Groove; Microelement; Molecular Dynamics; Monte Carlo Method; Nucleation; Numerical Analysis

Indexed keywords

ALUMINUM; ATOMS; COMPUTATIONAL METHODS; COMPUTER SIMULATION; ELECTRIC CONDUCTORS; FRACTURE MECHANICS; GRAIN BOUNDARIES; MECHANICS; MICROELECTRONICS; MONTE CARLO METHODS; NUCLEATION; NUMERICAL ANALYSIS;

EID: 0030197190     PISSN: 13408046     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea1993.39.3_291     Document Type: Article
Times cited : (5)

References (8)
  • 1
    • 0021295150 scopus 로고
    • Reliability Implications of Nitrogen Contamination during Deposition of Sputtered Aluminum/Silicon Metal Films
    • Klema, J., Pyle, R. and Domangue, E., Reliability Implications of Nitrogen Contamination During Deposition of Sputtered Aluminum/Silicon Metal Films, Proc. Int. Reliability Physics Symp., (1984), p. 1.
    • (1984) Proc. Int. Reliability Physics Symp. , pp. 1
    • Klema, J.1    Pyle, R.2    Domangue, E.3
  • 3
    • 0027627916 scopus 로고
    • A Numerical Simulation on Stress Induced Failure in Aluminum Conductors of a Microelectronic Package Based on Surface and Grain Boundary Diffusion
    • Kitamura, T., Ohtani, R. and Yamanaka, T., A Numerical Simulation on Stress Induced Failure in Aluminum Conductors of a Microelectronic Package Based on Surface and Grain Boundary Diffusion, JSME Int. J., Ser. A, Vol. 59 (1993), p. 1625.
    • (1993) JSME Int. J., Ser. A , vol.59 , pp. 1625
    • Kitamura, T.1    Ohtani, R.2    Yamanaka, T.3
  • 7
  • 8
    • 0004255385 scopus 로고
    • Chapter 2, McGraw-Hill Book Company
    • Shewmon, P. G., Diffusion in Solids, (1963) Chapter 2, McGraw-Hill Book Company.
    • (1963) Diffusion in Solids
    • Shewmon, P.G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.