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Volumn 39, Issue 3, 1996, Pages 291-296
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Atomic mechanics simulation on nucleation process of grain boundary groove in aluminum conductor of microelectronic packages
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Author keywords
Aluminum Conductor; Atomic Mechanics; Computational Mechanics; Grain Boundary Groove; Microelement; Molecular Dynamics; Monte Carlo Method; Nucleation; Numerical Analysis
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Indexed keywords
ALUMINUM;
ATOMS;
COMPUTATIONAL METHODS;
COMPUTER SIMULATION;
ELECTRIC CONDUCTORS;
FRACTURE MECHANICS;
GRAIN BOUNDARIES;
MECHANICS;
MICROELECTRONICS;
MONTE CARLO METHODS;
NUCLEATION;
NUMERICAL ANALYSIS;
ALUMINUM CONDUCTORS;
ATOMIC MECHANICS;
GRAIN BOUNDARY GROOVE;
MELTING TEMPERATURE;
MICROELECTRONIC PACKAGES;
MOLECULAR DYNAMICS;
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EID: 0030197190
PISSN: 13408046
EISSN: None
Source Type: Journal
DOI: 10.1299/jsmea1993.39.3_291 Document Type: Article |
Times cited : (5)
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References (8)
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