Plastic packages survive where hermetic packages fail

Microelectronics Reliability

Volumn 36, Issue 7-8 SPEC. ISS., 1996, Pages 1001-1018

  Sinnadurai, Nihal ^a  

^a Hill House   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL DEVICES; ENCAPSULATION; EPOXY RESINS; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONIC PROCESSING; MOISTURE; PLASTICS APPLICATIONS; RELIABILITY; STANDARDS;

DIGITAL SWITCHING SYSTEMS; FAILURE RATE; FIELD FAILURE RETURNS; HERMETIC PACKAGES; PLASTIC ENCAPSULATED COMPONENTS; PLASTIC PACKAGES;

ELECTRONICS PACKAGING;

EID: 0030196249     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00065-0     Document Type: Article

References (25)

1. F. M. Sinnadurai, "The Accelerated Ageing of Semiconductor Devices in Environments Containing a High Vapour Pressure of Water", Microelectronics and Reliability, Vol. 13, pp. 23-27, (1974).
2. N. Sinnadurai, "More Than a Decade of the Non-Saturating Autoclave as a Highly Accelerated Stress Technique for Evaluating the Reliability of Non-Hermetic Microelectronics Components", Microelectronics and Reliability, pp. 833-836, Vol. 24, (1983).
3. N. Sinnadurai, "An Evaluation of Plastic Coatings for High Reliability Microcircuits", Microelectronics. Journal, Vol 12, pp. 30-38, (1981).
4. H. Baudry and G. Kersuzan, "Individual Encapsulation for Integrated Circuits: How to Use Thermal Analysis to Optimise Curing Conditions Towards Reliability", Proc. 4th European Hybrid Microelectronics Conference, pp. 111-121, (1983).
5. S. M. Boyer, "Plastic Encapsulation of Active Devices on Hybrid Microcircuits", Proc. 4th European Hybrid Microelectronics Conference, pp. 122-132, (1983).
6. J. J. Granger, J. C. Basset, N. Vimont and P. Viret, "Wire Bonded Chips Encapsulation Using Resin Droplets", Proc. 4th European Hybrid Microelectronics Conference, pp. 146-154, (1983).
7. O. Mallem, J. Lantaires, "The Plastic Composite Package Provides an Economic Alternative to LSI-VLSI Packaging for High Density Microcircuits", Hybrid Circuits, Vol. 8, pp. 5-12, (1985)
8. P. Collander, M. K. H. Huhtanen, R. A. Mäkelä, S. M. Palo, "Humidity Testing of Plastic Coated Integrated Test Circuits", Proc. International Microelectronics Symposium, pp. 249-254, (1987).
9. N. Sinnadurai, "EPIC: A Cost-Effective Plastic Chip Carrier for VLSI Packaging", IEEE Trans. Components, Hybrids and Manufacturing Technology, Vol CHMT-8, pp. 386-390, (1985).
10. N. Sinnadurai, D. Roberts, "Assessment of Micropackaged Integrated Circuits in High Reliability Applications", Microelectronics Journal, Vol 14, pp. 5-25, (1983).
11. British Telecom Specification M219F for "Type Approval of Encapsulating Resins, Coatings and Adhesive Materials for Semiconductor Devices and Microcircuits", BT Group Technical Services.
12. C. P. Wong, "High Performance Silicone Gel as IC Device Chip Protection", Mat. Res. Soc. Symp. Vol. 108, pp. 175-187, (1988)
13. L. Condra, S. O'Rear, T. Freedman, L. Flancia, M. Pecht, D. Barker, "Comparison of Plastic and Hermetic Microcircuits Under Temperature Cycling and Temperature Humidity Bias", IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol 15, pp. 1-11, (1992)
14. J. W. Balde, "The Effectiveness of Silicone Gels", IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol 14, 1991.
15. I. P. Hall "Novel Low Cost Techniques for Low Cost, High Performance, Optoelectronic Component Assembly", Hybrid Circuits, Vol. 34, pp. 44-47, May (1994).
16. N. Sinnadurai, "MultiChip Module Applications in Communications Satellites", NATO Advanced Research Workshop on MCM/Mixed Technologies, Islamorada, Florida, ISBN 0-7923-3460-4, pp. 169-176, (1994), and Microelectronics International, Vol. 37, pp. 31-32, (1995).
17. N. Sinnadurai, "MultiChip Module Applications in Communications Satellites", NATO Advanced Research Workshop on MCM/Mixed Technologies, Islamorada, Florida, ISBN 0-7923-3460-4, pp. 169-176, (1994), and Microelectronics International, Vol. 37, pp. 31-32, (1995).
18. J. A. King "Living in Two Worlds", JC 13.5 meeting, USA, 6 May (1992).
19. T. K. Ramaswamy, T. S. Kuppuswamy, "Quality Aspects of Telecom Equipment", Telecommunications (the Indian Journal of Telecommunications), pp. 14-18, (1991).
20. D. Stroehle, "On the Penetration of Gases and Water Vapour into Packages with Cavities, and on Maximum Allowable Leak Rates", Proc. IEEE 15th Annual Reliability Physics Symposium, pp. 101-104, (1977).
21. "Report on Climatological Conditions Encountered by Telecom Equipments in India", General Manager TQA Circle, Department of Telecommunications, Bangalore, India, Issue 1, (1988)
22. "Specification for Environmental Testing of Electronic Equipment for Transmission and Switching Use", Telecom Quality Assurance Circle, Department of Telecommunications, Bangalore, India, QM-333, Issue 1, (1990).
23. F. N. Sinnadurai, "Handbook of Microelectronics Packaging and Interconnection Technologies", Electrochemical Publications Limited, 1st ed., pp. 6-7, 150, 153-155, (1985)
24. D S Peck, "Comprehensive Model for Humidity Testing Correlation", IEEE International Reliability Physics Symposium, pp. 44-50, (1986)
25. "Plastic-packaged ICs in military equipment", IEEE Spectrum, pp. 62-63, Feb., (1991).