Angle resolved X-ray photoelectron spectroscopic analysis on the surface of wet-etched copper

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 35, Issue 7, 1996, Pages 3869-3875

  Kang, Min Gu ^b   Jo, Moon Ho ^b   Park, Hyung Ho ^b   Kim, Chan Ho ^a  

^a Sangji University   (South Korea)

^b Yonsei University   (South Korea)

Author keywords

Angle resolved X ray photoelectron spectroscopy; Copper; Quantification; Surface bonding state; Wet etching

Indexed keywords

BONDING; COPPER; EXPERIMENTS; NONDESTRUCTIVE EXAMINATION; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

ANGLE RESOLVED X-RAY PHOTOELECTRON SPECTROSCOPY; COPPER WET ETCHING; SURFACE BONDING STATE;

ETCHING;

EID: 0030196065     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.3869     Document Type: Article

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