Fabrication of nickel microbump on aluminium substrate using electroless nickel plating

Transactions of the Institute of Metal Finishing

Volumn 74, Issue 4, 1996, Pages 138-141

  Watanabe, H ^a   Honma, H ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTROLESS PLATING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; SUBSTRATES;

NICKEL DISPLACEMENT PLATING; NICKEL MICROBUMP;

NICKEL PLATING;

EID: 0030195807     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.1996.11871113     Document Type: Article

References (6)

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2. H. Honma and Hagiwara, J. Electrochem. Soc., 142,81 (1995)
3. T. Kawanobe, K. Miyamoto and Y.Inaba, Proc. of Electronic Components., P. 149 (1981)
4. T. Kawanobe, K. Miyamoto and M. Hirano, Proc. of Electronic Components., P. 221 (1983)
5. H. Honma and T. Kobayashi, Hyomen Gijutsu, J. Surf. Finish Soc. Japan, 44, 1084 (1993)
6. H. Honma, H. Watanabe and T. Kobayashi, J. Electrochem. Soc., 141, 1791,(1994)