Air-cooling system for metal oxide semiconductor controlled thyristors employing miniature heat pipes

Journal of Thermophysics and Heat Transfer

Volumn 10, Issue 3, 1996, Pages 484-489

  Cao, Y ^a,c   Beam, J E ^b,c   Donovan, B ^b  

^a The Department of Electrical and Computer Engineering   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

^c AIAA ^*

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION; HEAT FLUX; HEAT PIPES; HEAT RESISTANCE; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; MACHINING; MOS DEVICES; TEMPERATURE; THERMAL CONDUCTIVITY; THYRISTORS; VISCOSITY;

AIR COOLING SYSTEM; COOLING AIR TEMPERATURE; DYNAMIC VISCOSITY; ELECTRIC DISCHARGE MACHINING; KINETIC VISCOSITY; LIQUID COOLANT TEMPERATURE; METAL OXIDE SEMICONDUCTOR CONTROLLED THYRISTORS; MINIATURE HEAT PIPE; THERMAL SPREADERS; WIRE CUTTING METHOD;

COOLING SYSTEMS;

EID: 0030195561     PISSN: 08878722     EISSN: 15336808     Source Type: Journal    
DOI: 10.2514/3.814     Document Type: Article

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