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Volumn 35, Issue 7, 1996, Pages 4027-4033
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Solid-phase reactions of diffusion barriers of Ti and TiN to copper layers on SiO2
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Author keywords
Adhesion promoter; Cu interconnect; Cu metallization; Diffusion barrier; TiN
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Indexed keywords
ADHESION;
COPPER;
DIFFUSION;
EXPERIMENTS;
SEMICONDUCTOR DEVICES;
X RAY DIFFRACTION;
ADHESION PROMOTER;
COPPER METALLIZATION;
DIFFUSION BARRIER;
THIN FILMS;
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EID: 0030195394
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.35.4027 Document Type: Article |
Times cited : (20)
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References (30)
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