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Volumn 35, Issue 7, 1996, Pages 4027-4033

Solid-phase reactions of diffusion barriers of Ti and TiN to copper layers on SiO2

Author keywords

Adhesion promoter; Cu interconnect; Cu metallization; Diffusion barrier; TiN

Indexed keywords

ADHESION; COPPER; DIFFUSION; EXPERIMENTS; SEMICONDUCTOR DEVICES; X RAY DIFFRACTION;

EID: 0030195394     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.35.4027     Document Type: Article
Times cited : (20)

References (30)
  • 27
    • 0003689862 scopus 로고
    • ed. T. B. Massalski ASM International, Ohio 2nd ed.
    • J. L. Murray: Binary Alloy Phase Diagrams, ed. T. B. Massalski (ASM International, Ohio 1990) 2nd ed.
    • (1990) Binary Alloy Phase Diagrams
    • Murray, J.L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.