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Volumn 156, Issue 1, 1996, Pages 63-70

Slip generation during rapid thermal processing

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEATING; SILICON WAFERS; TEMPERATURE MEASUREMENT; THERMOOXIDATION; THERMOPILES; X RAY ANALYSIS; YIELD STRESS;

EID: 0030194208     PISSN: 00318965     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssa.2211560109     Document Type: Article
Times cited : (4)

References (18)
  • 4
  • 16
    • 3342989192 scopus 로고
    • Ed. H. R. HIFF, R. J. KRIEGLER, and Y. TAKEISHI, Electrochem. Soc. Softbound Proc. Ser., Pennington (NJ)
    • Y. KONDO, in: Semiconductor Silicon 1981, Ed. H. R. HIFF, R. J. KRIEGLER, and Y. TAKEISHI, Electrochem. Soc. Softbound Proc. Ser., Pennington (NJ), 1981 (p. 220).
    • (1981) Semiconductor Silicon 1981 , pp. 220
    • Kondo, Y.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.